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Thermal pad Gelid TP-GP04-S-D — 120×120×2 mm, density 3.2 g/cm³, 1 pc
Summary description:
Gelid Solutions TP-GP04-S-D is a thermal pad designed for heat transfer between components and heatsinks. Dimensions are 120×120×2 mm with a material density of 3.2 g/cm³. Supplied as a single pad, it provides a compliant interface for CPUs, GPUs, power modules and other electronic parts where gap filling and thermal conduction are needed.