Thermal pad Gelid TP-VP04-C 90×50×1.5 mm, density 3.2 g/cm³, 2 pcs

Gelid TP-VP04-C thermal pad, sized 90×50×1.5 mm and supplied as 2 pieces per pack, is designed to improve heat transfer between electronic components and heatsinks. With a density of 3.2 g/cm³, this thermal pad fills gaps and compensates for height differences and uneven surfaces on PCBs and cooling assemblies. It is intended for use where reliable thermal contact is required between chips, VRMs, memory modules and other compact electronic parts.

Advantages

The Gelid TP-VP04-C provides consistent thermal bridging across irregular surfaces and small air gaps thanks to its compliant formulation and defined thickness. Supplied in two pieces, the pads are easy to position and cut to size for specific layouts. The material characteristics support straightforward application without curing, and the product is formulated to be non-electrically conductive and non-corrosive.

Suitable for

• Filling gaps between chips and heatsinks on graphics cards and motherboards
• Thermal interfacing for VRMs and power stages
• Cooling small SMD components and analog ICs
• Improving contact for memory modules and add-on cards

Key specifications

• Dimensions: 90 × 50 × 1.5 mm (per pad)
• Pack quantity: 2 pieces
• Density: 3.2 g/cm³
• Form: solid thermal pad, cuttable and conformable
• Typical applications: gap filling and thermal interface on PCBs and compact electronics

How to use

Clean mating surfaces to remove dust, grease or old thermal compound before applying the pad. Measure and cut the thermal pad to the required shape and size, then peel off any protective liners if present and place the pad onto the component or heatsink. Assemble the heatsink or retainers so the pad is compressed to form a continuous thermal contact; avoid excessive shear when positioning to maintain integrity of the pad. If reusing a pad is necessary, inspect for deformation or contamination and replace if performance may be compromised.

Usage recommendations

Use the pad to bridge moderate gaps up to the pad thickness and to improve heat conduction where standard thermal paste is impractical. Store the pads in a dry environment and handle with clean hands or gloves to avoid contamination that could reduce thermal performance.