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Thermal pad Gelid TP-VP04-C 90×50×1.5 mm, density 3.2 g/cm³, 2 pcs
Summary description:
Gelid TP-VP04-C is a thermal pad designed for heat conduction between components and heatsinks. Specifications: 90 × 50 × 1.5 mm size, density 3.2 g/cm³, supplied as 2 pieces per pack. Suitable for filling gaps, improving thermal contact on chips, VRMs, memory modules and small cooling assemblies in PCs and electronics.