Thermal pad Gelid TP-VP04-D — 90×50×2 mm, density 3.2 g/cm³, pack of 2

Gelid TP-VP04-D is a preformed thermal pad measuring 90×50×2 mm, supplied as a pack of two. With a material density of 3.2 g/cm³, this thermal pad is designed to provide reliable thermal transfer between electronic components and heatsinks, filling gaps and compensating for uneven surfaces on PCBs and densely packed assemblies.

Advantages

These thermal pads offer high thermal conductivity and are engineered to ensure consistent contact between components and heat-dissipating elements. The material is non-electrically conductive, non-corrosive, non-curing and non-toxic, supporting an extended operating temperature range. Their preformed shape and moderate thickness simplify placement and reduce installation time compared with liquid thermal compounds.

Suitable for

• Heat transfer between MOSFETs, chipsets and heatsinks
• Thermal bridging on GPU and motherboard power circuits
• Cooling of analog ICs, microcontrollers and SMD power components
• Small electronic assemblies and add-on cards with uneven surface contact

Key specifications

• Dimensions: 90 × 50 × 2 mm
• Material density: 3.2 g/cm³
• Pack content: 2 pieces
• Operating temperature range: -60 °C to 220 °C
• Electrical behavior: non-electrically conductive
• Chemical behavior: non-corrosive, non-curing, non-toxic

How to use

Clean contact surfaces to remove dust, grease and old thermal interface material. Cut or trim the Gelid TP-VP04-D pad if necessary to match component dimensions. Peel off any protective liner and place the pad directly onto the component or heatsink, ensuring full surface contact and alignment. Reassemble the assembly and apply mechanical pressure (fastening screws, clips or retention mechanisms) to promote uniform contact between the pad and mating surfaces. If rework is required, remove the pad carefully, clean surfaces and replace with a new pad as needed.

Usage recommendations

Use the thermal pad for components with small to moderate gap thickness where a stable, non-curing interface is preferred. Avoid stretching the pad during placement and ensure the pad covers the entire contact area for optimal heat transfer. For repeated disassembly, replace the pad rather than reusing a deformed piece to maintain thermal performance.