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Thermal pad Gelid TP-VP04-D — 90×50×2 mm, density 3.2 g/cm³, pack of 2
Summary description:
Gelid TP-VP04-D is a preformed thermal pad designed for heat transfer between components and heatsinks. Dimensions are 90 × 50 × 2 mm with a material density of 3.2 g/cm³. Supplied as 2 pieces per pack, it suits applications requiring easy placement and gap filling on PC components, power modules, or small electronic assemblies.