Thermal paste GENESIS Silicon 900 12.8 W/m·K 2 g — thermal interface compound with scraper

GENESIS Silicon 900 is a thermal paste with a thermal conductivity of 12.8 W/m·K and a density of 2.8 g/cm³ supplied in a 2 g pack. Designed to improve heat transfer between chips, heatsinks and cooling solutions, it helps maintain lower component temperatures in desktop PCs, laptops and consoles. The kit includes a spatula and a moistened cleaning cloth for convenient application and surface preparation.

Advantages

High thermal conductivity (12.8 W/m·K) ensures efficient heat transfer without the need for warming up; a non-conductive, corrosion-resistant formula reduces the risk of electrical shorts and long-term damage; the supplied spatula and moistened cloth simplify surface cleaning and accurate application, making the paste suitable even for less experienced users.

Suitable for

• CPU and GPU heatsink mounting in desktop computers
• Thermal interface replacement in laptops
• Thermal maintenance of gaming consoles and small form-factor systems

Key specifications

• Thermal conductivity: 12.8 W/m·K
• Density: 2.8 g/cm³
• Weight: 2 g (0.002 kg)
• Operating temperature range: -50 to 250 °C
• Non-electrically conductive and corrosion-resistant formula

How to use

Clean the surfaces to be joined using the included moistened cloth to remove old paste, dust and oils. Apply a small pea-sized amount of GENESIS Silicon 900 to the centre of the chip or component, then mount the heatsink and secure it according to the device manufacturer’s instructions. Excess paste can be removed with the spatula before final assembly. No preheating is required; the paste reaches effective thermal performance immediately after application.

Usage recommendations

Apply only a thin, even layer sufficient to fill microscopic gaps; avoid using excessive amounts that can reduce cooling efficiency. Use in a well-ventilated area and follow antistatic precautions when working inside electronic devices.