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Thermal paste GENESIS Silicon 900 12.8 W/m·K 2 g — thermal interface compound with scraper
Summary description:
GENESIS Silicon 900 is a thermal paste with thermal conductivity 12.8 W/m·K, density 2.8 g/cm³ and net weight 2 g. Suitable for filling gaps between CPUs, GPUs and heatsinks, it operates between −50 °C and 250 °C. Supplied as a single 2 g syringe/pack and includes a scraper for even application, improving heat transfer and cooling performance.