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Solder Lead-Free GOOBAY ø 1.0 mm, 17 g, 40843
GOOBAY lead-free solder wire ø 1.0 mm on a 17 g spool is intended for manual electronics soldering and small electrical repairs. The alloy composition is mainly tin with small additions of silver and copper, and it contains a 2.5% flux core to facilitate wetting and reduce oxidation during soldering. The 1.0 mm diameter wire offers a balance between control and flow for precision tasks such as component leads, small wires and through-hole soldering.
The lead-free composition meets requirements for RoHS-compliant assemblies and reduces exposure to lead in hobbyist and professional environments. The incorporated flux core streamlines the soldering workflow by eliminating the need to apply separate flux for many standard tasks. The 1.0 mm diameter and 17 g spool format provide convenient handling and storage for occasional repairs and electronics assembly.
Use a suitable temperature-controlled soldering iron set above the alloy melting point (typically 330–380 °C depending on tip size and thermal mass) and ensure the joint surfaces are clean and mechanically secure. Heat the pad and component lead first, then apply the solder wire to the heated joint rather than directly to the iron tip to achieve proper wetting. Allow the molten solder to flow and form a smooth fillet; remove heat and let the joint cool without movement. For delicate SMD work, use fine tips and minimal solder amount to avoid bridging.
Work in a well-ventilated area and use appropriate personal protective equipment. For best results on oxidation-prone surfaces, lightly clean contacts with isopropyl alcohol beforehand. When higher mechanical strength or different electrical properties are required, verify alloy suitability before use.
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