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Solder wire GOOBAY lead-free 1.0 mm diameter 100 g reel for electronics assembly
GOOBAY lead-free solder wire, 1.0 mm diameter on a 100 g reel, is designed for electronics assembly, repair and prototyping. The alloy composition contains 99% tin, 0.3% silver and 0.7% copper with a 2.5% flux core. With a melting point of approximately 217° C, this solder wire is suitable for manual through-hole soldering and for some surface-mount tasks where a thicker wire is acceptable. The flux core is integrated into the wire to simplify soldering and reduce the need for additional flux application.
The alloy formulation ensures reliable wetting and mechanical strength for typical electronic joints while remaining lead-free. The 1.0 mm diameter offers a balance between ease of feed and material control for rework and assembly of larger pads and leads. The integrated flux core streamlines workflow by cleaning oxides at the joint during heating and improving solder flow. Supplied on a compact 100 g reel, the wire is convenient for bench work and portable tool kits.
Prepare the workpiece by cleaning contact surfaces to remove dirt and oxidation. Set the soldering iron to an appropriate temperature for the alloy and wire diameter—temperatures around and slightly above the melting point (typically 320–370° C on many irons for this type of lead-free solder) are commonly used; adjust based on tip size and heat transfer. Heat the joint, apply the solder wire to the heated area (not directly to the iron tip) and allow the molten solder to flow and form a smooth fillet. Remove heat and let the joint cool undisturbed. Use appropriate personal protective equipment and ventilation when soldering.
For best results with the 1.0 mm wire, use a suitably sized iron tip and sufficient thermal capacity to heat larger pads and leads. If working on small SMD pads, consider using thinner diameter solder or additional flux. Store the reel in a dry place and avoid prolonged exposure to humidity to preserve flux effectiveness.
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