Solder Wire Lead-Free GOOBAY ø 1.5 mm 250 g

GOOBAY lead-free solder wire with a 1.5 mm diameter and 250 g net weight is designed for electrical and electronic soldering where a lead-free alloy is required. The alloy composition combines 99% tin with minor additions of silver and copper, and an integrated flux core, providing a consistent feed for manual soldering, repairs and assembly of circuit boards, wires and components. The flux core simplifies wetting and helps produce reliable joints on a range of devices and connectors.

Advantages

This solder wire is a lead-free formulation that supports compliance with lead-free regulations and reduces lead exposure during soldering. The 1.5 mm diameter delivers good solder flow for both small and mid-sized joints while remaining easy to control during manual work. A 2.5% flux core is already integrated into the wire, which improves solderability by removing oxides and promoting wetting on metal surfaces. The specified melting point ensures predictable behaviour during standard electronic soldering operations.

Suitable for

• Soldering and repair of printed circuit boards (PCBs), including SMD and DIP components
• Joining and repairing cables, connectors and wiring harnesses
• Maintenance and repair of consumer electronics such as televisions, headphones and microphones
• Hobby electronics, model making and prototyping tasks

Key specifications

• Alloy composition: approximately 99% tin, 0.3% silver, 0.7% copper
• Flux core content: 2.5% (integrated)
• Diameter: 1.5 mm
• Net weight: 250 g
• Melting point: 217 °C
• Formulation: lead-free solder wire suitable for electronic applications

How to use

Prepare the work area and ensure proper ventilation. Clean the surfaces to be soldered to remove dirt and oxidation. Heat the joint with a suitably powered soldering iron until the area reaches the solder melting temperature, then feed the GOOBAY solder wire to the heated joint so the flux and alloy flow to form a smooth fillet. Avoid overheating components; allow the joint to cool naturally. Trim excess solder if needed and inspect the joint for good wetting and electrical continuity.

Usage recommendations

Use a soldering iron with an appropriate tip size and temperature control, typically around or slightly above the melting point (approximately 330–370 °C depending on tip, component sensitivity and heat transfer). Keep ventilation or local extraction to reduce fumes, and follow standard safety precautions such as eye protection and avoiding skin contact with molten solder. For sensitive SMD components, consider preheating or using heat-sinks and adjust technique to minimize thermal stress.