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Solder Lead-Free GOOBAY ø 0.56 mm 250 g spool — 40851
Solder Lead-Free GOOBAY ø 0.56 mm 250 g spool — 40851
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Solder Lead-Free GOOBAY ø 0.56 mm 250 g spool — 40851
Leave your address - as soon as the price of the product goes down, you'll know about it right away
Solder Lead-Free GOOBAY ø 0.56 mm 250 g spool — 40851
Solder Lead-Free GOOBAY ø 0.56 mm 250 g spool — 40851
GOOBAY lead-free solder, 0.56 mm diameter on a 250 g spool, is formulated for electrical and electronic soldering where a lead-free alloy is required. The wire composition is primarily tin with minor silver and copper additions and an integrated flux core. Its 0.56 mm thin diameter and consistent feed from the spool make it suitable for precise work on PCB pads, component leads and wiring in repair, prototyping and low-temperature production environments. The solder has a melting point of approximately 217° C and contains 2.5% flux core for improved wetting and ease of use.
This solder offers homogeneous wetting of solder joints due to the rosin-based flux core, supporting reliable electrical connections and reducing the likelihood of cold joints. The no-clean flux formulation minimizes the need for post-solder cleaning in many applications. Its halogen-free makeup and low smoke emission reduce contamination and user exposure during soldering. Reduced spattering improves safety and protects surrounding components and the workpiece. The thin 0.56 mm diameter is optimized for fine-detail soldering of SMDs, DIP components and small wires.
Use with an appropriately rated soldering iron or soldering station set to a temperature suitable for the alloy (around or slightly above the melting point of 217 °C, typically 320–360 °C depending on joint size and heat transfer). Ensure the workpiece is clean and mechanically secure before applying heat. Apply the solder to the heated joint, allowing the wire to feed smoothly from the spool so that the flux core activates and promotes wetting. Withdraw heat once the solder has flowed and formed a smooth, concave fillet; avoid prolonged heating that may damage components or boards. Use appropriate fume extraction and personal protective equipment.
For reliable results, clean oxidation from contact surfaces prior to soldering when necessary, use flux sparingly only if additional activation is required, and maintain a soldering tip in good condition. For sensitive electronics, control soldering time and temperature to prevent component or PCB damage and use local extraction to reduce exposure to fumes.
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