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Goobay LSP 100 LC 1 pc(s) Desoldering pump
The Goobay LSP 100 LC desoldering pump is a lightweight metal tool designed for efficient removal of solder from electronic components and circuit boards. It delivers high suction power to extract melted solder, solder residues and flux, enabling cleaner contact points and preparation for rework or component replacement. The pump is universally compatible and supplied as a single unit, suitable for workshop, hobbyist and professional repair environments.
The body constructed from light metal ensures durability while keeping the tool easy to handle during prolonged use. A pump tip made of antistatic Teflon provides reliable performance and reduces the risk of thermal or static damage when in contact with a heated soldering iron. The design focuses on efficient solder removal to leave clean soldering surfaces and minimise the need for additional cleaning steps.
Heat the solder joint with a compatible soldering iron until the solder liquefies. Position the Teflon pump tip directly over the molten solder and trigger the pump to extract the solder. Repeat heating and pumping as needed to remove remaining solder. After use, wipe the pump tip clean and, if necessary, clear the internal channel of accumulated solder while the tool is cool and handled with appropriate safety precautions.
Use appropriate personal protective equipment and work in a well-ventilated area. For best results, ensure the soldering iron is at the correct temperature for the solder alloy in use and avoid excessive contact time to protect components and PCB traces.
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