Solder wire IBP 3.0 mm, soft solder, 100 g

IBP soft solder wire with 3.0 mm diameter on a 100 g spool is intended for general-purpose soldering tasks where a low-melting filler is required. The alloy is suitable for joining copper, brass and similar metals in electrical, electronic and plumbing applications, and it is designed for use with a soldering iron or a handheld torch. The compact 100 g spool format provides a convenient supply for repair, assembly and maintenance jobs.

Advantages

The 3.0 mm diameter core provides a steady filler flow for medium-sized joints while the soft solder composition ensures reliable wetting on copper and brass surfaces. The spool format keeps the wire organised and easy to handle during intermittent work. The wire melts at a temperature appropriate for manual soldering methods, reducing the risk of overheating sensitive components when used with proper technique.

Suitable for

• Electrical and electronic joint repair and assembly
• Plumbing connections on copper and brass fittings
• General maintenance and hobby metalwork

Key specifications

• Wire diameter: 3.0 mm
• Spool weight: 100 g
• Alloy type: soft/low-melting solder
• Compatible heating methods: soldering iron or handheld torch
• Recommended base metals: copper, brass and similar non-ferrous metals

How to use

Clean the surfaces to be soldered to remove oxidation, oils and contaminants. Heat the joint evenly with a soldering iron or torch until the base metal reaches the melting range of the solder, then apply the IBP solder wire to the heated area, allowing the molten solder to flow into the joint by capillary action. Remove heat and allow the joint to cool naturally. For electronic assemblies use appropriate temperature control and avoid prolonged exposure to heat-sensitive components.

Usage recommendations

Use appropriate personal protective equipment such as heat-resistant gloves and eye protection. Work in a well-ventilated area or use local extraction to avoid inhaling flux fumes. Store the spool in a dry place away from corrosive chemicals and high humidity to preserve solder quality.