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Thermal paste Iceberg FUZEIce 11.25 W/m·K 7 g, thermal interface compound
Thermal paste Iceberg FUZEIce 11.25 W/m·K 7 g, thermal interface compound
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Thermal paste Iceberg FUZEIce 11.25 W/m·K 7 g, thermal interface compound
Leave your address - as soon as the price of the product goes down, you'll know about it right away
Thermal paste Iceberg FUZEIce 11.25 W/m·K 7 g, thermal interface compound
Thermal paste Iceberg FUZEIce 11.25 W/m·K 7 g, thermal interface compound
Iceberg FUZEIce 11.25 W/m·K 7 g is a thermal interface compound designed to improve heat transfer between processors, graphics chips and heatsinks in desktop and compact systems. With a thermal conductivity of 11.25 W/m·K and a density of 2.6 g/cm³, the paste fills microscopic surface irregularities to reduce thermal resistance and support more efficient cooling. The product is supplied in a 7 g tube with an integrated precision applicator and an angled spreader for controlled, low-mess application.
FUZEIce combines relatively high thermal conductivity with a formulation that remains stable under extended operation up to 200 °C. The included precision applicator and angled spreader simplify application, minimising excess material and making it suitable for both experienced builders and first-time users. The compound’s physical properties promote consistent thermal contact and long-term reliability when properly applied.
Clean mating surfaces thoroughly with isopropyl alcohol and a lint-free cloth to remove old thermal material and contaminants. Apply a small, pea-sized amount of FUZEIce to the centre of the chip or follow the manufacturer’s preferred spread pattern. Use the angled spreader to create a thin, even layer that fills surface irregularities without excess overflow. Reattach the heatsink and fasten to the recommended torque or mounting pressure. Allow the system to complete a few thermal cycles to ensure the paste settles and any trapped air is reduced.
For optimal results, apply a thin, even layer and avoid over-application; excess paste can reduce thermal transfer efficiency. Use in well-ventilated work areas and store the tube capped at room temperature. Replace thermal paste during major component upgrades or if thermal performance degrades noticeably over time.
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