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Thermal paste Iceberg FUZEIce 11.25 W/m·K 7 g, thermal interface compound
Summary description:
Iceberg FUZEIce is a thermal paste thermal interface compound with thermal conductivity of 11.25 W/m·K and density 2.6 g/cm³. Supplied in a 7 g tube for single-unit use, it improves heat transfer between CPUs, GPUs or other heat-generating components and heatsinks, suitable for desktop and compact systems.