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Thermal paste Iceberg FUZEIce Plus — 13 W/m·K, 3.5 g thermal compound
Thermal paste Iceberg FUZEIce Plus — 13 W/m·K, 3.5 g thermal compound
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Thermal paste Iceberg FUZEIce Plus — 13 W/m·K, 3.5 g thermal compound
Leave your address - as soon as the price of the product goes down, you'll know about it right away
Thermal paste Iceberg FUZEIce Plus — 13 W/m·K, 3.5 g thermal compound
Thermal paste Iceberg FUZEIce Plus — 13 W/m·K, 3.5 g thermal compound
Iceberg FUZEIce Plus thermal paste is a high-conductivity thermal interface compound supplied in a 3.5 g syringe. With a published thermal conductivity of 13 W/m·K and a density of 2.6 g/cm³, this compound is formulated to form a thin, consistent thermal layer between processor surfaces and heatsinks. The product includes a precision applicator and an angled spreader to simplify application for desktop builds, laptop repairs and cooling upgrades while helping maintain effective heat transfer under typical operating conditions.
The compound combines relatively low operating temperature characteristics with high thermal conductivity to support efficient heat dissipation. A precision applicator and angled spreader reduce application mess and help achieve an even, thin bond line. FUZEIce Plus is rated for operational temperatures up to 200°C and is designed for long-term stability to maintain thermal performance over time.
Ensure both surfaces (CPU/GPU heatspreader and heatsink base) are clean and free of old thermal compound, dust and oils. Apply a small, pea-sized amount of FUZEIce Plus to the centre of the chip, or dispense a thin line for larger dies. Use the included angled spreader if required to obtain a uniform thin layer; alternatively, allow the heatsink pressure to spread the compound when mounting. Refit the heatsink evenly and tighten mounting hardware according to the manufacturer’s torque sequence to avoid uneven pressure.
For optimal thermal transfer, use a minimal amount to form a continuous thin layer between surfaces. Avoid contaminating the compound with dirt or moisture, and store the syringe capped in a cool, dry place when not in use. Replace thermal paste during major servicing or if thermal performance degrades over time.
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