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Thermal paste Iceberg FUZEIce Plus — 13 W/m·K, 3.5 g thermal compound
Summary description:
Iceberg FUZEIce Plus thermal paste is a thermal interface compound with thermal conductivity 13 W/m·K and density 2.6 g/cm³, delivered in a 3.5 g syringe. Designed to improve heat transfer between CPUs, GPUs or other electronic components and heatsinks, it provides a thin, uniform thermal layer for desktop builds, laptop repair, and cooling upgrades.