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Weight:
Weight of the product without packaging (net weight). If possible, the net weight is given including standard accessories and supplies. Please note that sometimes the manufacturer leaves out the weight of accessories and/or supplies.
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0.0152 kg
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Internal memory type:
The type of internal memory such as RAM, GDDR5.
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DDR4
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Storage temperature (T-T):
The minimum and maximum temperatures at which the product can be safely stored.
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-55 - 100
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Package weight:
Weight of the packaged product.
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40.3 g
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Operating temperature (T-T):
The minimum and maximum temperatures at which the product can be safely operated.
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0 - 85
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Height:
The measurement of the product from head to foot or from base to top.
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30 mm
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ECC:
ECC means Error Correction Code, and it is memory that is able to detect and correct some memory errors without user intervention.
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No
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Module configuration:
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2048M x 64
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CAS latency:
Column Address Strobe (CAS) latency, or CL, is the delay time between the moment a memory controller tells the memory module to access a particular memory column on a RAM module, and the moment the data from the given array location is available on the module's output pins. In general, the lower the CAS latency, the better.
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20
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Width:
The measurement or extent of something from side to side.
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3.8 mm
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Depth:
The distance from the front to the back of something.
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69.6 mm
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Memory clock speed:
The frequency at which the memory (e.g. RAM) runs.
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1600 MHz
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Country of origin:
Country where the device is made. Aka Country of manufacture (COM).
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China, Taiwan
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Row cycle time:
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45.75 ns
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Refresh row cycle time:
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350 ns
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Row active time:
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26.25 ns
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Backlight:
Product has a built-in light source for its illuminating.
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No
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Package depth:
The distance from the front to the back of the packaging.
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14 mm
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Package height:
The distance from the top to the bottom of the packaging.
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171.5 mm
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Package width:
The distance from one side of the packaging to the other.
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95.3 mm
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Master (outer) case height:
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101.6 mm
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Master (outer) case width:
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203.2 mm
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Memory voltage:
The voltage (V) of the memory in the device.
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1.2
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Cooling type:
The method used to cool the device or to cool the air around the device.
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Heatsink
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Memory form factor:
Design of the memory e.g. 240-pin DIMM, SO-DIMM.
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260-pin SO-DIMM
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Memory ranking:
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1
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Component for:
What this product is used as a part of (component for).
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Laptop
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Internal memory:
A computer's memory which is directly accessible to the CPU.
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32 GB
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Memory layout (modules x size):
How the overall memory of the product is put together, defined by the number of modules and the size.
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2 x 16
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Master (outer) case gross weight:
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1218.9 g
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Intel Extreme Memory Profile (XMP):
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Yes
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Master (outer) case length:
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311.2 mm
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Products per master (outer) case:
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25 pc(s)
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Harmonized System (HS) code:
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84733020
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JEDEC standard:
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Yes
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Programming power voltage (VPP):
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2.5 V
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Memory data transfer rate:
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3200 MT/s
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Buffered memory type:
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Unregistered (unbuffered)
