Microchip ACK I SLIMSASX8 Microcontroller Module 0.8M (MPN 2305800-R)

ACK I SLIMSASX8 Microcontroller Module 0.8M from Microchip is a compact embedded control module designed for integration into small devices, development boards and prototype systems. The module provides Microchip processing capabilities in a space-efficient package and is intended for applications where the specified 0.8M performance meets project requirements. Its form factor and interfaces make it suitable for use in power-constrained, size-limited designs that require reliable MCU functionality.

Advantages

The module combines a small footprint with a defined 0.8M parameter to deliver predictable performance for embedded tasks. It offers straightforward integration into existing hardware designs and supports common development workflows used with Microchip components. The unit’s compact design reduces board area and can simplify enclosure design while enabling rapid prototyping and small-scale production runs.

Suitable for

• Prototyping and development boards
• Embedded control in compact consumer or industrial devices
• Small-scale production where space and power are constrained
• Educational projects and hardware proof-of-concept builds

Key specifications

• Form factor: compact module designed for PCB integration
• Performance class: specified at 0.8M for processor capability
• Primary use: embedded control and application processing
• Compatibility: designed to integrate with standard Microchip development workflows and interfaces
• Typical applications: control logic, sensor interfacing, simple communication tasks

How to use

Mount the module to a compatible PCB footprint following the module’s mechanical and electrical interface requirements. Provide required power supply rails and connect any peripheral signals, communication lines or sensor interfaces to the host board. Use Microchip development tools and toolchains to program firmware appropriate to the 0.8M performance class. Verify pin assignments and voltage levels against the module reference documentation before applying power and during initial bring-up.

Usage recommendations

Use the module in designs where a compact MCU solution with predictable 0.8M capability is sufficient. For development, pair the module with a Microchip-compatible programmer and debug tools, perform signal integrity and power sequencing checks, and validate thermal conditions in the intended enclosure. For production, ensure proper soldering and handling procedures to maintain reliability.