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Thermal paste GENESIS Silicon 900 12.8 W/m·K 2 g
GENESIS Silicon 900 is a thermal paste formulated to improve heat transfer between heatsinks and electronic components. Supplied in a 2 g package, the paste offers a rated thermal conductivity of 12.8 W/m·K and a density of 2.8 g/cm³. The kit includes a spatula and a moistened cloth to simplify application and cleaning.
GENESIS Silicon 900 provides high thermal conductivity from the moment it is applied, without preheating. The compound has a safe, non-conductive formula and is resistant to corrosion, reducing the risk of electrical shorting. The package contains practical accessories (spatula and moistened cloth) that make application and cleanup easier even for less experienced users.
Clean the contact surfaces thoroughly using the supplied moistened cloth or an appropriate solvent and allow them to dry. Apply a small, pea-sized amount of the thermal paste to the centre of the chip, then mount the heatsink and secure it according to the manufacturer’s instructions so the paste spreads evenly. Use the supplied spatula to smooth excess compound if required, and wipe away any residue with the supplied cloth.
Apply a minimal, even layer to avoid excessive paste that can reduce thermal performance. Reapply thermal paste when removing the heatsink or during routine maintenance, and ensure surfaces are clean and dry before each application.
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