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Thermal paste GENESIS Silicon 900 12.8 W/m·K 2 g
Summary description:
GENESIS Silicon 900 is a thermal paste designed for efficient heat transfer with a thermal conductivity of 12.8 W/m·K. It has a density of 2.8 g/cm³ and comes in a 2 g package. Ideal for use in cooling applications to enhance the performance of CPUs and GPUs.