Thermal paste GENESIS Silicon 900 12.8 W/m·K 8 g

GENESIS Silicon 900 is a thermal paste with a thermal conductivity of 12.8 W/m·K and a density of 2.8 g/cm³ supplied in an 8 g pack. It is formulated to improve heat transfer between processors, GPUs and cooling solutions, helping to maintain lower component temperatures without electrical conductivity or corrosive effects. The kit includes a spatula and a moistened cloth to simplify application and cleanup.

Advantages

GENESIS Silicon 900 provides high thermal conductivity immediately after application and does not require preheating. Its non-conductive, corrosion-resistant formula reduces the risk of electrical shorts, while the included applicator spatula and moistened cloth make surface preparation and paste distribution easier. The product’s density ensures controlled, even spread on contact surfaces.

Suitable for

• Desktop CPU and GPU cooling
• Laptop processor and graphics cooling
• Game consoles and compact electronics
• System rebuilds and routine thermal maintenance

Key specifications

• Thermal conductivity: 12.8 W/m·K
• Net weight: 8 g (0.008 kg)
• Density: 2.8 g/cm³
• Operating temperature range: -50 to 250 °C
• Electrical conductivity: non-conductive (safe formula)

How to use

Clean the heat-spreader and heatsink surfaces thoroughly using the included moistened cloth or an appropriate solvent and allow them to dry. Apply a small pea-sized amount of GENESIS Silicon 900 to the center of the chip, then mount the cooler and let the pressure spread the paste into a thin, even layer. If needed, use the spatula to distribute the paste before seating the cooler, taking care to avoid excessive application.

Usage recommendations

For best results, replace thermal paste when replacing or reseating the cooler, after long periods of heavy use, or if temperatures rise unexpectedly. Use only a thin, uniform layer—excess paste does not improve cooling and may complicate cleanup.