Solder wire with flux 1.00 mm, 500 g, No name (C-D60 1 500)

Solder wire with integrated flux, 1.00 mm diameter on a 500 g spool. Designed for manual soldering of electronic components, wires and small metal joints, this solder wire combines a consistent alloy core with a flux center to improve wetting and solder flow. It is suitable for common electronics materials such as copper and tin‑plated surfaces and is intended for use in hobby projects, repairs and prototype assembly where a medium‑thickness solder wire is required.

Advantages

The flux‑cored design reduces the need for separate flux application and supports reliable solder joints by helping to remove oxides during heating. A 1.00 mm diameter provides a balance between controlled solder feed and adequate heat transfer for small to medium joints. The 500 g spool offers extended working life for repeated tasks and reduces spool changes during a single project.

Подходит для

• Ручной пайки электронных плат и компонентов
• Соединения проводов и мелких металлических швов
• Ремонтных работ и прототипирования
• Хобби‑проектов и обучения пайке

Key specifications

• Wire diameter: 1.00 mm
• Spool weight: 500 g
• Flux core: integrated (flux‑cored solder)
• Typical applications: copper, tin‑plated surfaces and common electronic materials
• Form: solid wire on spool for manual soldering

How to use

Prepare the work area with adequate ventilation and a suitable soldering iron with a tip appropriate for the joint size. Heat the joint, apply the solder wire to the heated area rather than the iron tip, and allow the molten solder to flow and wet the surfaces. The integrated flux will aid in oxide removal and improve wetting; remove any flux residues after cooling if required by the application. Use standard safety precautions for temperature, fume exposure and handling of molten metal.

Usage recommendations

For best results, use a soldering iron temperature matched to the solder alloy and joint size, keep the tip clean and tinned, and apply solder sparingly to avoid bridging on densely packed circuits. Clean flux residues when working on sensitive electronics if the flux is not classified as no‑clean.