Tin solder wire with flux 2.00 mm, 500 g — No name

Tin solder wire with integrated flux, 2.00 mm diameter and 500 g spool weight is designed for general-purpose soldering in electronics, electrical work and small metal repairs. The wire combines a tin-based filler with a flux core to promote wetting and reliable joint formation. Its mid-range diameter provides controlled heat transfer and filler delivery for through-hole components, wire splices and small mechanical joints.

Advantages

The integrated flux core reduces the need for separate flux application, simplifying preparation and reducing assembly time. A 2.00 mm diameter balances melting rate and control, making the wire suitable for tasks that require moderate filler volume without excessive heat input. The 500 g spool offers extended working length for workshop repairs and repeated use, while the tin-based composition provides good conductivity and corrosion resistance appropriate for many general soldering situations.

Suitable for

• Soldering through-hole electronic components and connectors
• Repairing wires, cables and small harnesses
• Joining small metal parts and brackets
• Prototyping and hobby electronics requiring mid-thickness wire

Key specifications

• Wire diameter: 2.00 mm
• Spool weight: 500 g
• Core type: integrated flux
• Material: tin-based solder (flux-cored)
• Typical use temperature: compatible with standard soldering irons and stations

How to use

Secure the workpieces and clean contact surfaces to remove oxides and contaminants. Heat the joint with an appropriate soldering iron or station set to a temperature suitable for tin-based solders. Feed the solder wire to the heated joint so the solder melts and is drawn into the connection by capillary action; avoid direct contact of the wire with the iron tip. Allow the joint to cool without movement to form a solid, shiny connection. If necessary, clean residual flux according to the flux type and safety data before final inspection.

Usage recommendations

Use protective ventilation and eye protection when soldering. Select an iron temperature that provides efficient melting without excessive heat exposure to components—typically a temperature compatible with common tin-based alloys. For electronic assemblies, consider post-solder cleaning if the flux is not classified as no-clean to prevent long-term residue effects.