Solder wire with flux 2.50 mm, 250 g spool — No name C-D60 25 250

Solder wire with integrated flux on a 250 g spool, 2.50 mm diameter, designed for manual and workshop soldering of electrical and electronic connections. This core solder combines filler metal and flux to improve wetting, reduce oxidation and simplify the soldering process. The medium-thickness diameter offers a balance between flow and control, suitable for tasks that require reliable joints and a stable feed from the spool.

Advantages

This solder wire features an internally deposited flux that eliminates the need for separate flux application in many cases, helping to speed up assembly and repair work. The 2.50 mm diameter provides consistent material feed and good thermal mass for rapid joint formation, while the 250 g spool reduces the frequency of spool changes in workshop or production environments. The formulation supports dependable wetting on typical copper and tinned surfaces found in electrical and electronic components.

Suitable for

• Manual soldering of electrical wires and terminals
• Workshop repairs of circuit boards and electronic modules (where medium core solder is appropriate)
• Hobby electronics and prototyping that require a robust, easy-to-handle solder wire
• Small assembly tasks where integrated flux simplifies workflow

Key specifications

• Wire diameter: 2.50 mm
• Spool weight: 250 g
• Flux: integrated core flux
• Intended use: manual and workshop soldering of electrical and electronic connections
• Typical compatibility: copper and tinned component surfaces

How to use

Prepare the surfaces to be soldered by ensuring they are mechanically clean and free of heavy oxidation, oils or contaminants. Heat the joint with a suitable soldering iron or soldering station and apply the solder wire to the heated area, allowing the integrated flux to activate and the solder to flow into the joint. Maintain appropriate temperature control to avoid overheating components; remove heat once a smooth, shiny fillet has formed and allow the joint to cool naturally. If necessary, clean residual flux according to the flux type and the sensitivity of nearby components.

Usage recommendations

Use a soldering iron with adequate power for the workpiece size, and select a tip that provides good thermal contact. For electronics use, avoid excessive dwell time to protect sensitive components. If residues are unacceptable for the application, perform flux-cleaning with a suitable solvent or flux remover after soldering.