Thermal paste QOLTEC 51646 — thermal conductivity 3.17 W/m·K, weight 0.5 g

QOLTEC 51646 is a thermal paste formulated to improve heat transfer between electronic components and heatsinks. With a declared thermal conductivity of 3.17 W/m·K and thermal resistance of 0.067 °C/W, this thermal interface material is supplied as a 0.5 g quantity in a single pack. The paste is electrically insulating, fills micro-gaps between a processor and cooling base, and is presented for use in small-scale cooling applications where efficient conduction and long-term stability are required.

Advantages

The compound combines relatively high thermal conductivity with electrical insulation, enabling safer contact with components. It is designed to evenly fill microscopic unevenness on contact surfaces, improving thermal coupling without requiring large quantities. The product is described as easy to apply and stable over time, maintaining its thermal properties and reducing the need for frequent replacement.

Suitable for

• CPU cooling in desktop and small form-factor systems
• GPU cooling for compact graphics modules
• Power ICs and voltage regulators on circuit boards
• Small heatsinks and embedded electronics thermal interfaces

Key specifications

• Thermal conductivity: 3.17 W/m·K
• Thermal resistance: 0.067 °C/W
• Weight: 0.5 g
• Electrical characteristic: insulating (non-conductive)
• Form: paste for manual application

How to use

Clean both mating surfaces (chip and heatsink) from old thermal compound, dust and oils using isopropyl alcohol or a manufacturer-recommended cleaner, and allow them to dry. Apply a small, pea-sized amount of QOLTEC 51646 onto the center of the processor or component. Mount the heatsink and secure it evenly so the paste spreads into a thin, continuous layer; avoid excessive pressure or applying excessive paste, which can reduce thermal transfer. For power ICs or irregular surfaces, use a thin, even layer to ensure full coverage of contact areas. Follow component manufacturer guidance for mounting torque and sequence where applicable.

Usage recommendations

Store the product in a cool, dry place and avoid contamination of the paste by dust or moisture. Use the supplied quantity for small-scale applications; for larger assemblies select an amount sufficient to create a continuous interface layer without overflow. Reinspect thermal performance during routine maintenance and reapply only if thermal characteristics degrade or after removal of the heatsink.