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Thermal paste QOLTEC 51646 — thermal conductivity 3.17 W/m·K, weight 0.5 g
Summary description:
QOLTEC 51646 is a thermal paste designed to improve heat transfer between electronic components and heatsinks. It has thermal conductivity of 3.17 W/m·K and thermal resistance of 0.067 °C/W, supplied as a 0.5 g quantity in one pack. Suitable for CPUs, GPUs, power ICs and other small-scale cooling applications requiring efficient thermal interface material.