Thermal paste ENDORFY Pactum 4 12 W/m·K 1.5 g

ENDORFY Pactum 4 12 W/m·K 1.5 g is a thermal paste formulated to improve heat transfer between a processor (CPU) or other heat-generating components and their coolers. With a thermal conductivity of 12 W/m·K and a specific gravity of 2.6 g/cm³, this 1.5 g blister pack is intended for precise application where a small amount of high-performance thermal interface material is required.

Advantages

Pactum 4 provides relatively high thermal conductivity for efficient heat transfer in compact quantities. The included spatula simplifies application and helps create a thin, even layer to maximize contact between the chip surface and cooler. The product is packaged in a 1.5 g blister suitable for single or occasional use and is compatible with standard CPU and component cooling assemblies.

Suitable for

• Desktop CPU and GPU cooling maintenance or upgrades
• Small form-factor builds where only a small amount of paste is needed
• Replacing old or degraded thermal interface material on chips and heatsinks

Key specifications

• Thermal conductivity: 12 W/m·K
• Specific gravity: 2.6 g/cm³
• Weight/volume: 1.5 g (0.0015 kg)
• Packaging: blister pack with spatula
• Brand: SilentiumPC (ENDORFY)
• MPN: EY0C003, EAN: 5903018666358

How to use

Clean the processor and cooler contact surfaces to remove old paste and dust. Apply a small, thin amount of Pactum 4 to the center of the chip and use the included spatula to spread an even, thin layer across the surface. Reattach the cooler according to the cooler manufacturer's instructions, ensuring even pressure and correct mounting. Avoid applying excessive amounts—thin, continuous contact improves thermal transfer.

Usage recommendations

Use Pactum 4 on properly prepared surfaces and reapply when replacing or reseating coolers; store the blister at room temperature and avoid contamination of the paste for best results.