Thermal paste Thermal Grizzly TG Putty 40 g

Thermal Grizzly TG Putty is an electrically non-conductive gap filler designed as an alternative to conventional thermal pads. It is intended primarily for GPU modifications and for replacing thermal pads between the PCB and the cooler, compensating height differences and enabling reliable contact between components and heatsinks. TG Putty is supplied with spatulas for easy, large-area application and can fill gaps from 0.2 mm to 3.0 mm. It is offered in three variants differing by thermal conductivity: Basic (medium), Advance (good) and Pro (excellent). A single 30 g container is typically enough for smaller graphics cards’ VRAM and VRM; larger cards or backplate-to-PCB gaps may require two 30 g containers. TG Putty is not suitable for use directly on CPU integrated heat spreaders (IHS) or on the GPU die.

Advantages

TG Putty provides electrically non-conductive thermal transfer while remaining flexible and easy to apply. It compensates uneven heights and fills gaps that would normally require different thicknesses of thermal pads, reducing the need to stock multiple pad sizes. The included spatulas allow precise and wide-area application. Available in three thermal-conductivity grades, the product can be selected according to cooling requirements.

Suitable for

• Replacing thermal pads on GPU PCBs (VRAM, VRM)
• Modifying GPU coolers or converting an air cooler to a water block
• Filling PCB-to-backplate gaps on larger graphics cards

Key specifications

• Form: thermal putty (gap filler)
• Electrical property: non-conductive
• Applicable gap range: 0.2 mm – 3.0 mm
• Available variants: TG Putty Basic, Advance, Pro (different thermal conductivities)
• Typical container sizes referenced: 30 g per container (usage varies by card size)
• Included accessories: 3 spatulas

How to use

Clean and degrease the target surfaces thoroughly before application, for example with isopropanol or dedicated cleaning wipes. Use the supplied spatulas to apply TG Putty evenly to the contact area, ensuring the putty fills the gap and creates full contact between the PCB components and the cooler. Spread and smooth the putty to the required thickness within the specified gap range (0.2–3.0 mm). Reassemble the cooler and verify firm, even contact. Do not apply TG Putty directly onto CPU IHS or the GPU die.

Usage recommendations

For single smaller graphics cards without an active backplate (e.g., GeForce GTX 1060), one 30 g container is usually sufficient for the front-side components. For very large cards (e.g., GeForce RTX 4090) expect to use one 30 g container for front-side VRAM/VRM and approximately two 30 g containers to fill a large uniform backplate gap. Always avoid using putty on bare dies or CPU IHS and ensure surfaces are clean and dry before application.