Solder Lead Velleman SOLDERDISP 185 °C 17 g

Velleman SOLDERDISP 185 °C 17 g is a solder lead formulated for electronic assembly and repair work. With a melting point of 185 °C and convenient 17 g dosing, this solder provides consistent melting behavior and reliable wetting on common electronic components and printed circuit boards. The formulation is intended to produce good flow and adhesion for through-hole and small surface-mount soldering tasks.

Advantages

This solder lead offers a clear melting point at 185 °C that supports predictable soldering temperatures and reduces the risk of overheating sensitive components. Its 17 g size is practical for small projects, quick repairs, and dispensing systems where compact amounts are required. The solder is designed to deliver good solder joint quality with adequate mechanical strength and electrical conductivity when applied under appropriate soldering conditions.

Suitable for

• Repairing small consumer electronics and circuit boards
• Hobby electronics and DIY projects
• Through-hole and small SMD component soldering
• Prototyping and maintenance work in labs and workshops

Key specifications

• Melting point: 185 °C
• Net weight: 17 g
• Form: solder lead (rod/wire for dispensing)
• Intended use: electronic soldering for PCB and component joints

How to use

Heat the soldering iron to an appropriate temperature above the melting point of 185 °C, taking into account the joint size and component sensitivity. Clean the parts to be joined and, if necessary, apply suitable flux. Bring the soldering iron tip in contact with the joint to heat both the pad and the component lead, then feed the solder lead to the heated area until a smooth fillet forms. Remove the solder first, then the iron, and allow the joint to cool undisturbed to form a reliable connection.

Usage recommendations

Use appropriate personal protective equipment and work in a well-ventilated area. Select a soldering temperature that minimizes thermal stress to components while ensuring proper wetting. Use compatible flux and cleaning methods to achieve durable, low-resistance solder joints.