Thermal paste XILENCE XZ018 / ZUB-XPTP 5.15 W/m·K 1.5 g, black/white

Thermal paste XILENCE XZ018 / ZUB-XPTP 5.15 W/m·K is a precision thermal interface compound supplied in a 1.5 g blister pack. Designed to improve heat transfer between processors, graphics chips and heatsinks, this compound features a black/white formulation and a thermal conductivity of 5.15 W/m·K. The material remains stable and effective across a wide operating temperature range from −30 °C to 280 °C, making it suitable for standard desktop, workstation and some industrial electronics cooling tasks.

Advantages

The compound’s thermal conductivity of 5.15 W/m·K supports efficient heat flow from the heat-generating component to the cooler, helping to maintain lower junction temperatures. Its formulated consistency allows thin, even application to fill microscopic gaps between mating surfaces without excessive squeeze-out. The operating temperature window from −30 °C to 280 °C ensures performance under a broad range of environmental and operating conditions. Supplied in a small 1.5 g quantity and packaged in a single blister, the product is practical for individual repairs, upgrades or small-scale system builds.

Suitable for

• CPU and GPU thermal interface application during assembly or rework
• Cooling improvements for compact desktop and workstation systems
• Repair and maintenance tasks requiring a small quantity of thermal compound

Key specifications

• Thermal conductivity: 5.15 W/m·K
• Net weight: 1.5 g (0.0015 kg)
• Operating temperature range: −30 °C to 280 °C
• Colour: black / white formulation
• Packaging: single unit blister pack

How to use

Clean both the component and heatsink mating surfaces with isopropyl alcohol and a lint-free cloth to remove old paste, oils and debris. Apply a small, pea-sized amount of XILENCE XZ018 / ZUB-XPTP to the centre of the CPU or GPU die, then mount the heatsink and secure it according to the manufacturer’s instructions to allow the compound to spread evenly. For larger or irregular surfaces, apply a thin, even line or multiple small dots as appropriate. Avoid using excessive amounts; a thin, continuous thermal interface layer provides the best thermal transfer.

Usage recommendations

Allow assembled systems to run through a thermal cycle after application and check temperatures under load to confirm correct application. Replace the thermal paste during processor or cooler changes, and store unused material in a cool, dry place away from direct sunlight and extreme temperatures to preserve consistency.