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Thermal paste XILENCE XZ018 / ZUB-XPTP 5.15 W/m·K 1.5 g, black/white
Summary description:
Thermal paste XILENCE XZ018 / ZUB-XPTP is a 1.5 g thermal interface compound with thermal conductivity 5.15 W/m·K. Supplied in black/white formulation, it operates from −30 °C to 280 °C and is intended for improving heat transfer between CPUs, GPUs or other electronic components and heatsinks. Packaged in a blister, single unit per pack.