Thermal paste XILENCE X5 2.5 g — high thermal conductivity compound for CPU/GPU heat transfer

XILENCE X5 thermal paste is a 2.5 g high-thermal-conductivity compound formulated to improve heat transfer between processors and cooling solutions. Intended for use on CPUs and GPUs, this thermal grease fills microscopic surface irregularities to reduce thermal resistance and help maintain lower operating temperatures in desktops, workstations and gaming systems. The paste has a spreadable consistency that allows for a thin, even layer and reliable contact between the heat source and the cooler base.

Advantages

The XILENCE X5 offers improved thermal conductivity compared with untreated interface gaps, enabling more efficient heat flow from silicon dies to heatsinks or cold plates. Its low-bleed, stable composition supports consistent long-term thermal performance without rapid drying or significant pump-out under normal operating conditions. The small 2.5 g tube is convenient for single-system applications or targeted reapplications and is compatible with common metal and ceramic cooler base materials.

Suitable for

• Desktop CPU cooling and aftermarket heatsinks
• GPU cooling and graphics card maintenance
• Small form-factor builds and compact workstations
• System reassembly after component upgrades or maintenance

Key specifications

• Net weight: 2.5 g of thermal compound
• High thermal conductivity formulation for improved heat transfer
• Paste consistency suitable for thin, uniform application
• Compatible with typical CPU and GPU cooler materials (metal, ceramic)
• Intended for desktop and workstation processor interfaces

How to use

Clean the processor heat spreader and cooler base with isopropyl alcohol and a lint-free cloth to remove old compound and contaminants. Apply a small amount of XILENCE X5 thermal paste to the center of the processor surface and spread it thinly and evenly with an applicator or allow the cooler’s mounting pressure to distribute the paste during installation. Mount the cooler according to the manufacturer’s instructions, ensuring even pressure and secure fastening. After initial operation, verify temperatures to confirm correct application; reapply if excessive temperatures indicate poor contact.

Usage recommendations

Store the thermal paste in a cool, dry place and avoid exposure to extreme heat or direct sunlight. Use protective gloves if desired and avoid getting compound on electrical contacts or PCB components. For best results, use a pea-sized or thin-line application appropriate to the processor package size and follow the cooler manufacturer’s guidance on mounting and torque specifications.