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AiO.lv Thermal paste XILENCE X5 2.5 g — high thermal conductivity compound for CPU/GPU heat transfer Similar products

Alternatives and similar models for Thermal paste XILENCE X5 2.5 g

Thermal paste XILENCE X5 2.5 g Photo 1

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Thermal paste XILENCE X5 2.5 g — high thermal conductivity compound for CPU/GPU heat transfer
Summary description: XILENCE X5 thermal paste is a 2.5 g high-thermal-conductivity compound designed to improve heat transfer between processors and coolers. Intended for CPUs and GPUs, it fills microscopic gaps to reduce operating temperatures and enhance cooling efficiency. Easy to apply in a thin layer, it supports stable thermal performance in desktops, workstations and gaming rigs.
Manufacturer: XILENCE
Category: Thermal Paste
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