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Product specification Xilence XZ018 heat sink compound 5.15 W/m·K 1 g
Features
Features
Thermal resistance:
0.201 °C/W
Viscosity note:
73 CPS
Thermal conductivity:
5.15 W/m·K
Technical details
Continuous use temperature (UL (E147128)):
280 °C
Weight & dimensions
Weight:
0.001 kg
Height:
15 mm
Width:
110 mm
Depth:
25 mm
Description
73 CPS, 5.15 W/m-K, 0.201°C in²/W, 1g
The Xilence Thermal Paste has a high thermal conductivity guarantees an efficient heat exchange and low temperatures. The paste works reliably at temperatures from -30 to +280°C
