Thermal Paste Xilence XZ018 5.15 W/m·K

The Xilence Thermal Paste XZ018 provides high thermal conductivity of 5.15 W/m·K and low thermal resistance of 0.201 °C/W, ensuring efficient heat transfer between a processor or graphics chip and its cooler. The compound is formulated for stable performance across a wide temperature range from -30 to +280°C and comes in a compact cartridge suitable for precise application. Dimensions: 110 mm x 25 mm x 15 mm.

Advantages

Xilence XZ018 combines a measured thermal conductivity of 5.15 W/m·K with low viscosity (73 CPS) for straightforward application and consistent contact between surfaces. Its rated operating range from -30 to +280°C ensures reliability under typical and demanding operating conditions, while the low thermal resistance helps maintain lower component temperatures.

Suitable for

• CPU cooling (desktop and workstation processors)
• GPU cooling (graphics cards and dedicated GPU coolers)
• Heatsinks, cold plates and other electronic components requiring thermal interface material

Key specifications

• Thermal conductivity: 5.15 W/m·K
• Thermal resistance: 0.201 °C/W
• Viscosity: 73 CPS
• Operating temperature range: -30 to +280°C
• Dimensions: 110 mm x 25 mm x 15 mm
• Weight: 0.001 kg

How to use

Clean both mating surfaces (CPU/GPU heatspreader and cooler base) of old paste, dust and oils before application. Apply a small, pea-sized amount of Xilence XZ018 to the center of the heatspreader, then mount the cooler and tighten according to the cooler manufacturer's instructions to spread the compound evenly. For larger IHS or bespoke spreader requirements, a thin, uniform layer can be applied with a suitable applicator.

Usage recommendations

Store the thermal paste in a cool, dry place and keep the cap closed when not in use. Avoid contact with skin and eyes; follow standard ESD precautions when working inside a computer. Reapply paste when replacing coolers or if thermal performance degrades.