Thermal Compound Akasa AK-460 3.3 W/m·K 3.5 g

Thermal Compound Akasa AK-460 3.3 W/m·K 3.5 g is a pro-grade silicone-based thermal paste designed to improve heat transfer between CPUs or other electronic components and heatsinks. The compound offers a thermal conductivity of 3.3 W/m·K, low thermal resistance (0.16 cm²·°C/W at 60 µm bond line thickness), and works across a wide temperature range from -45 °C to 200 °C. The 3.5 g syringe is suitable for multiple applications and is RoHS compliant.

Advantages

The Akasa AK-460 provides efficient heat transfer due to its high thermal conductivity and low thermal resistance, while remaining electrically non-conductive to reduce risk of short circuits. Its pro-grade silicone formulation exhibits low bleed under high pressure and stable performance over a wide temperature range. The product includes multi-language instructions and is provided in a convenient syringe for controlled application.

Suitable for

• CPU and GPU cooling gap filling
• Heatsink-to-component thermal interface for desktops and workstations
• Small electronics and embedded systems requiring improved thermal coupling
• Reapplications and maintenance where a 3.5 g amount is sufficient

Key specifications

• Thermal conductivity: 3.3 W/m·K
• Thermal resistance: 0.16 cm²·°C/W @ 60 µm BLT
• Weight: 3.5 g (0.0035 kg)
• Operating temperature range: -45 °C to 200 °C
• Electrical property: Non-conductive
• Compliance: RoHS

How to use

Clean both mating surfaces (CPU heat spreader and heatsink base) with isopropyl alcohol and a lint-free cloth. Dispense a small amount of the Akasa AK-460 thermal compound from the syringe onto the center of the CPU or the heatsink according to the component size. Spread evenly if preferred or install the heatsink directly to allow pressure to distribute the paste into a thin bond line. Secure the cooler according to the manufacturer’s instructions and power the system. Reapply during maintenance or when replacing cooling components.

Usage recommendations

Apply a thin, even layer to achieve the specified 60 µm bond line thickness for optimal thermal resistance. Avoid applying excessive amounts, as over-application will not improve cooling performance and can complicate future maintenance.