Thermal pad Gelid TP-GP04-S-E — 120×120×3 mm, density 3.2 g/cm³, 1 pc

Gelid TP-GP04-S-E is a pre-cut thermal pad sized 120×120×3 mm designed to provide an efficient thermal interface between electronic components and heatsinks. With a material density of 3.2 g/cm³ and supplied as one pad per pack, this thermal pad fills gaps and compensates for uneven surfaces on PCBs and modules, improving heat transfer from DRAM ICs, VRM ICs, power MOSFETs, M.2 SSDs and other high-temperature SMD components. The pad is non-electrically conductive, non-corrosive, non-curing and non-toxic, and supports an extended operating temperature range from -60°C to 220°C.

Advantages

The GP-Ultimate 120×120 combines an enhanced multilayer matrix and a material composition engineered for thermal performance, delivering up to 15 W/mK thermal conductivity for effective heat dissipation. Its non-conductive and non-corrosive properties reduce risk of electrical shorts and chemical damage to nearby components. Because the pad does not cure, it maintains conformity and gap-filling characteristics over repeated assemblies and extended use. The single-piece 120×120 mm format covers enlarged surfaces such as RAM modules and GPU/CPU VRM areas, simplifying installation on densely packed boards.

Suitable for

• Thermal bridging between heatsinks and DRAM ICs, VRM ICs and power MOSFETs
• Cooling interfaces for M.2 type SSDs and NVRAM modules
• Gap filling on uneven PCB surfaces in graphics cards and motherboards
• Thermal management in compact or tightly packed electronic assemblies

Key specifications

• Dimensions: 120 × 120 × 3 mm
• Material density: 3.2 g/cm³
• Thermal conductivity: 15 W/mK
• Operating temperature range: -60°C to 220°C
• Electrical behaviour: non-electrically conductive
• Chemical/physical: non-corrosive, non-curing, non-toxic
• Package quantity: 1 pad

How to use

Prepare the surfaces by powering off the device and ensuring heatsink and component contact areas are clean, dry and free of dust or old thermal material. Remove protective liners from both sides of the pad, align the pad to cover the target component or area, and press gently to achieve full surface contact while avoiding trapped air. Trim the pad if necessary to match smaller components or to avoid covering surrounding connectors. Reassemble the device and verify contact between the heatsink and component; secure cooling hardware according to the manufacturer’s instructions.

Usage recommendations

For optimal performance, use the Gelid TP-GP04-S-E where a compliant, non-curing thermal interface is required to bridge gaps and uneven surfaces. Avoid stretching the pad during placement and replace the pad if it becomes contaminated or physically damaged. Do not rely on the pad as mechanical support; ensure secure mounting of heatsinks and modules through proper fasteners.