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Thermal pad Gelid TP-GP04-S-E — 120×120×3 mm, density 3.2 g/cm³, 1 pc
Summary description:
Gelid TP-GP04-S-E is a pre-cut thermal pad designed for heat conduction between components and heatsinks. Dimensions are 120×120×3 mm with material density 3.2 g/cm³. Supplied as one pad per pack, it provides gap filling and thermal interface for CPUs, GPUs, power modules and other electronic components needing improved heat transfer.