Thermal paste QOLTEC 51642 heat sink compound 3.05 W/m·K, 5 g, gold

QOLTEC 51642 heat sink compound is a gold-coloured thermal paste formulated to improve heat transfer between electronic components and their cooling systems. With a thermal conductivity of 3.05 W/m·K and thermal resistance of 0.073 °C/W, this 5 g pack is designed for use in CPUs, GPUs, power electronics and other assemblies where efficient thermal coupling is required. The compound fills micro-gaps and surface irregularities to reduce thermal impedance and is offered in a compact tube for maintenance, upgrades and thermal performance tuning.

Advantages

The paste combines relatively high thermal conductivity with electrical insulation, enabling safe use around sensitive circuits while enhancing heat flow to heatsinks. Its gold-coloured formula is easy to apply and spreads evenly to create a thin, consistent thermal interface. The product maintains its properties over extended periods, reducing the need for frequent reapplication during regular maintenance cycles.

Suitable for

• Applying between CPUs or GPUs and their heatsinks during builds or upgrades
• Improving thermal contact in power electronics and voltage regulators
• Maintenance of cooling systems in desktops, workstations and compact systems
• Thermal tuning and optimization in custom cooling assemblies

Key specifications

• Thermal conductivity: 3.05 W/m·K
• Thermal resistance: 0.073 °C/W
• Net weight: 5 g
• Colour: Gold
• Electrical behaviour: thermally conductive, electrically insulating

How to use

Clean both mating surfaces thoroughly to remove old compound, dust and grease. Apply a small, pea-sized amount of thermal paste to the centre of the processor or component surface, or use a thin line or cross pattern depending on the component size and manufacturer guidance. Mount the heatsink with even pressure to spread the compound into a thin, uniform layer. Remove and reapply the paste if the heatsink is removed for servicing; otherwise a single proper application will typically remain effective for long-term use.

Usage recommendations

Use minimal amounts to avoid excess squeeze-out; ensure even mounting pressure and avoid touching the contact surfaces after cleaning. Store the tube in a cool, dry place and keep the cap closed to prevent drying. For best thermal results, follow the component or motherboard manufacturer’s guidance on paste amounts and application patterns.