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AiO.lv Thermal paste QOLTEC 51642 heat sink compound 3.05 W/m·K, 5 g, gold Similar products

Alternatives and similar models for Thermal paste QOLTEC 51642 3.05 W/m·K 5 g

Thermal paste QOLTEC 51642 3.05 W/m·K 5 g Photo 1

Based on this product's specifications, here are some alternatives and similar models

Thermal paste QOLTEC 51642 heat sink compound 3.05 W/m·K, 5 g, gold
Summary description: QOLTEC 51642 is a heat sink compound (thermal paste) with thermal conductivity 3.05 W/m·K and thermal resistance 0.073 °C/W. Supplied in a 5 g pack, its gold-coloured formula is intended for improving heat transfer between components and heatsinks in CPUs, GPUs, power electronics and cooling assemblies. Useful for maintenance, upgrades and thermal performance tuning.
Manufacturer: QOLTEC
Category: Thermal Paste
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Heat Sink Compound Qoltec 51644
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Thermal paste QOLTEC 51650 — thermal conductivity 4.63 W/m·K, grey, 1 g
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Thermal paste QOLTEC 51635 — heat sink compound for CPU/GPU thermal interface
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Thermal paste QOLTEC 51640 — heat sink compound, generic thermal interface material
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Thermal paste QOLTEC 51645 — thermal conductivity 3.17 W/m·K, 1 g, silver
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Thermal paste Iceberg FUZEIce 11.25 W/m·K, 3.5 g — heat sink compound
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