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Thermal Paste Xilence XZ018 5.15 W/m·K
Summary description:
Xilence XZ018 thermal compound offers excellent thermal conductivity of 5.15 W/m·K and low thermal resistance of 0.201 °C/W. With a viscosity of 73 CPS, it ensures easy application and effective heat transfer between components. Dimensions: 110 mm x 25 mm x 15 mm. Ideal for CPU and GPU cooling solutions.