Thermal Pad Gelid TP-GP05-B 120×20×1 mm — thermal interface material for heat transfer

Gelid TP-GP05-B is a thermal pad sized 120 × 20 × 1 mm designed to act as a thermal interface material that improves heat transfer between electronic components and heatsinks. The pad provides a soft, conformable layer that fills micro-gaps and uneven surfaces to enhance thermal contact without the mess of liquid pastes. It is suitable for applications that require easy cut-to-size installation and consistent thermal performance in compact assemblies.

Advantages

The material offers a balance of flexibility and thermal conductivity, enabling reliable contact on irregular surfaces while maintaining stable thermal performance. Its thin 1 mm profile allows use in confined spaces and tight tolerances, and the pre-cut strip format simplifies placement and trimming for custom fits. Because it is a solid pad rather than a liquid compound, it reduces the risk of migration and cleanup during installation.

Suitable for

• Cooling small PC components such as MOSFETs and voltage regulators
• Improving heat dissipation on SSDs and M.2 drives
• Thermal bridging for RAM modules and compact motherboards
• Thermal management in small appliances and embedded electronics

Key specifications

• Dimensions: 120 × 20 × 1 mm
• Form factor: conformable thermal pad
• Application type: thermal interface between components and heatsinks
• Installation: cut-to-size for custom fitting
• Suitable for compact and low-profile assemblies

How to use

Measure the area to be bridged and trim the thermal pad to the required shape and size using scissors or a sharp blade. Clean both contact surfaces to remove dust, oils, or residues before application. Remove protective liners if present, position the pad between the component and heatsink, and apply firm even pressure to ensure full contact and conformity to surface irregularities. Reassemble the device according to manufacturer instructions and verify mounting stability.

Usage recommendations

For best results, use the pad in applications where a thin, stable interface is required and avoid excessive compression that could squeeze the pad beyond its effective thickness. Store unused material flat in a dry environment away from direct sunlight. If higher thermal conductivity is required, consider combining with appropriate heatsink design or using a thicker or higher-performance interface in areas with larger gaps.