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Thermal Pad Gelid TP-GP05-B 120×20×1 mm — thermal interface material for heat transfer
Summary description:
Gelid TP-GP05-B is a thermal pad measuring 120 × 20 × 1 mm designed as a thermal interface material for transferring heat between components and heatsinks. The pad provides a conformable layer to fill micro-gaps, improving thermal contact in applications such as cooling small PC components, SSDs, RAM modules, and compact electronics where consistent thermal conductivity and easy cut-to-size installation are required.