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Thermal paste GENESIS Silicon 900, 12.8 W/m·K, 8 g — thermal grease for CPUs and GPUs
Summary description:
GENESIS Silicon 900 is a thermal paste with thermal conductivity 12.8 W/m·K and an 8 g syringe. Density 2.8 g/cm³, operating temperature range −50 to 250 °C. Supplied with a scraper for easy application. Designed to improve heat transfer between processors, GPUs and coolers, reduce temperatures and support stable operation in desktop PCs and workstations.