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Thermal paste QOLTEC 51630 — heat sink compound for CPU/GPU cooling
Summary description:
QOLTEC 51630 is a heat sink compound (thermal paste) designed to improve thermal transfer between processors and cooling solutions. It is used to fill microscopic gaps between a CPU or GPU and a heatsink or cooler, enhancing heat dissipation and stabilizing operating temperatures in desktop PCs, laptops and other electronic devices that require effective thermal interface material.