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AiO.lv Thermal compound QOLTEC 51631 — heat sink paste for CPU/GPU cooling Similar products

Alternatives and similar models for Thermal compound QOLTEC 51631

Thermal compound QOLTEC 51631 Photo 1

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Thermal compound QOLTEC 51631 — heat sink paste for CPU/GPU cooling
Summary description: QOLTEC 51631 is a heat sink thermal compound designed to improve thermal transfer between processors and cooling solutions. As a paste-based interface material, it fills microscopic gaps between CPU/GPU surfaces and heatsinks to enhance heat dissipation and maintain stable operating temperatures. Suitable for PC builds, repairs and upgrades where reliable thermal conduction is needed.
Manufacturer: QOLTEC
Category: Thermal Paste
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