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Thermal paste Iceberg Thermal FUZEIce Plus
Summary description:
Iceberg Thermal FUZEIce Plus is a high-performance thermal paste with a thermal conductivity of 13 W/m·K. It has a density of 2.6 g/cm³ and comes in a 3.5 g package. This thermal compound ensures efficient heat transfer between components, enhancing cooling performance and reliability. Ideal for CPUs, GPUs, and other electronic devices, it provides excellent thermal management for optimal operation.