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Thermal paste Iceberg Thermal FUZEIce Plus
Summary description:
Iceberg Thermal FUZEIce Plus is a high-performance thermal paste with a thermal conductivity of 13 W/m·K and a density of 2.6 g/cm³. Weighing 7 g, it is designed for efficient heat transfer between components, ensuring optimal cooling. This thermal paste is ideal for use in CPUs, GPUs, and other electronic devices, providing reliable performance and longevity.