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Thermal paste QOLTEC 51639 — heat sink compound, general-purpose thermal interface material
Summary description:
QOLTEC 51639 is a heat sink compound designed as a thermal interface material for transferring heat between electronic components and cooling solutions. This thermal paste is intended for use between CPUs, GPUs, power semiconductors or other heat-generating components and heatsinks or coolers. It ensures improved thermal contact and helps reduce operating temperatures in computers and electronic devices.